3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces
نویسندگان
چکیده
Three-dimensional (3D) integration is an emerging technology that vertically stacks and interconnects multiple materials, technologies and functional components to form highly integrated micro/nano-systems. This paper reviews the materials and technologies for three wafer bonding approaches to 3D integration using adhesive, metal, and metal/adhesive as the bonding interfaces. Similarities and differences in architectural advantages and technology challenges are presented, with recent research advances discussed.
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